ESD Testing of Aluminum and Copper Vertical Parallel plate (VPP) Capacitor Structures
E. Gebreselasie
Steven Voldman2007, 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual
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High speed interface are more and more integrated on System On Chip (SOC) and need efficient Electro Static Discharge (ESD) protections devices. The challenge is to ensure high level of ESD protection in a very large bandwidth to address HDMI, SATA, DisplayPort and USB interfaces. Another challenge is to address a large panel of technology nodes as high seed interfaces are implemented in various technologies. This paper shows performances of RF protection devices in term of ESD robustness and frequency response. Experimental results are presented and compared in 250 nm, 130 nm and 40 nm technologies nodes and shows ability of protections to sustain 2kV Human Body Model (HBM) with 30Ghz bandwidth in large voltage dynamic range.
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