Interfacial Phenomena

Interfacial Tension Measurements of the (H2O + n-Decane + CO2) Ternary System at Elevated Pressures and Temperatures

by Apostolos Georgiadis

Apostolos Georgiadis, Geoffrey Maitland, J. P. Martin Trusler, and Alexander Bismarck

Numerical modeling of Kelvin–Helmholtz instability using smoothed particle hydrodynamics

by Mostafa Safdari Shadloo

Interface micromotion of cementless hip stems in simulated hip arthroplasty

by Nazri Kamsah

Publication: American Journal of Applied Sciences (Magazine/Journal)
Date: September 1, 2009
Publisher: Science Publications
Volume: 6 Issue: 9 Page: 1682(8)

Cementless hip stems come in different shapes and sizes. In order to analyze practically the effect of these different... more Cementless hip stems come in different shapes and sizes. In order to analyze practically the effect of these different geometries on primary stability, they should be grouped into several categories based on their features. There is no consensus at the moment in terms of grouping cementless stems according to their geometry, mostly due to the large variety of cementless stems available in the market. Healy (1) grouped cementless femoral components into 5 basic types with examples of each-the cylindrical distal filling (the AML, the solution), the anatomic, proximal fit and fill (the PCA, the anatomic), combination (the S-ROM, the bridge), dual, tapered wedge (the Omnifit, the Summit) and flat, tapered wedge (the Tri-Lock, the Accolade). Mallory et al...

Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single …

by Nazri Kamsah

Journal of Electronics Packaging, Volume 124, Issue 1, 12, March 2002

Authors: Nazri Kamsah, Todd S Gross and Igor I Tsukrov

The finite element method was used to estimate the stresses in single level, 1 µm thick Cu-dielectric interconnect... more The finite element method was used to estimate the stresses in single level, 1 µm thick Cu-dielectric interconnect line arrays with Ta liners resulting from heating from 20°C to 400°C assuming that the structure was stress free at 20°C. Benzocyclobutene (BCB) and SiO2 were chosen to represent typical polymer and ceramic dielectric materials being evaluated for Cu damascene interconnect structures. Experimentally observed Cu-Ta and Cu-Cu interfacial sliding was incorporated into the model using a 1 nm thick creep element that was calibrated to match the predictions of a classical diffusion-accommodated sliding model. The effect of Cu-Ta and Cu-Cu interfacial sliding was evaluated by comparing the relaxed and unrelaxed stresses. The effect of line width-to-thickness (w/t) ratio and Ta liner thickness on the shear, normal, and Ta liner-plane stresses at the Cu-Ta-dielectric interface was investigated because this interface is a likely failure site.

Interfacial tension measurements and modelling of (carbon dioxide + n-alkane) and (carbon dioxide + water) binary mixtures at elevated pressures and temperatures

by Apostolos Georgiadis

Apostolos Georgiadis, Felix Llovell, Alexander Bismarck, Felipe J. Blas, Amparo Galindo, Geoffrey C. Maitland, J.P.Martin Trusler and George Jackson

Interfacial Tension Measurements of the (H2O + CO2) System at Elevated Pressures and Temperatures

by Apostolos Georgiadis

Apostolos Georgiadis, Geoffrey Maitland, J. P. Martin Trusler, and Alexander Bismarck

FORMATION OF NOVEL Cu 3 Au ALLOY PHASE UNDER CONFINEMENT

by Alokmay Datta